Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Patrick R. Morrow0
Date of Patent
June 29, 2010
Patent Application Number
11673375
Date Filed
February 9, 2007
Patent Primary Examiner
Patent abstract
Methods of forming a microelectronic structure are described. Embodiments of those methods include bonding at least one bond pad of a device side of a first substrate to at least one bond pad of a device side of a second substrate, forming at least one via to connect to at least one of an active feature and an interconnect structure disposed within the first substrate, and forming a reactive material on a surface of at least one of the active features.
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