Patent attributes
The present invention is a specially designed PCB that allows XFP compliant transceiver modules and EMI gaskets to be used in a manner specified in the XFP standard and results in an integrated solution that is compliant with the XFP standard. Various geometric features are incorporated into the PCB to achieve improvements that in combination result in an integrated solution meeting the XFP standard. Some of these improved features include: specific thickness of prepreg and other layering of the PCB, specific spacing, dimensions and weights for certain components of the PCB, an opening on the first layer XFP cage ground shield connecting to the EMI gasket, guard ground traces in the second layer surrounding the differential pair signal traces, openings in the copper of the third layer beneath the XFP cage ground shield and XFP connector pads, and ground vias at the XFP connector and PHY connector pads.
