Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
July 6, 2010
Patent Application Number
11360812
Date Filed
February 24, 2006
Patent Primary Examiner
Patent abstract
A technique for increasing the compliance of tin-indium solders is disclosed. In one particular exemplary embodiment, the technique may be realized as a lead free solder alloy comprising from about 58.0% to about 99.998% by weight tin, from about 0.001% to about 40.0% by weight indium, and from about 0.001% to about 2.0% by weight at least one rare earth element.
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