An LED lamp includes a body comprising a supporting ring and a holding ring. A heat sink cover is mounted to a top surface of the supporting ring to cover a top end of the body. The heat sink cover comprises a plate and a plurality of fins formed on a top surface thereof. An LED module is received in the body and mounted to a bottom surface of the plate. A transparent envelope is mounted to the holding ring to cover a bottom end of the body. A retaining ring is mounted to a bottom surface of the holding ring to secure the transparent envelope in position. A suspension device is mounted to the heat sink cover. A power module is disposed in the suspension device.