US Patent 7753761 Wafer polishing apparatus and wafer polishing method

The present invention provides a wafer polishing apparatus, comprising: a polishing pad to which a polishing liquid is supplied for polishing a wafer; a carrier head to carry the wafer; and one or more polishing liquid supplying device which supplies the polishing liquid onto the polishing pad, wherein the polishing liquid supplying device has a polishing liquid supplying member which is positioned close to or in contact with the polishing pad, and is relatively moved against the polishing pad, so that the polishing liquid supplied to the upper portion of the polishing liquid supplying member flows down along the polishing liquid supplying member to be painted on a surface of the polishing pad.