Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Zao-Kuo Lai0
Wei-Hung Lin0
Date of Patent
July 13, 2010
0Patent Application Number
120682560
Date Filed
February 5, 2008
0Patent Primary Examiner
Patent abstract
Method for making a coreless packaging substrate are disclosed in the present invention. The coreless packaging substrate is made by first providing a metal adhesion layer having a melting point lower than that of the substrate, and removing a core board connected with the substrate therefrom through melting the metal adhesion layer. In addition, the disclosed packaging substrate further includes a circuit built-up structure of which has the electrical pads embedded under a surface. The disclosed packaging substrate can achieve the purposes of reducing the thickness, increasing circuit layout density, and facilitating the manufacturing of the substrate.
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