US Patent 7754983 Electronic parts packaging structure and method of manufacturing the same

A method of manufacturing an electronic parts packaging structure, including the steps of preparing an electronic parts forming substrate in which an MEMS element is formed in a formation region and a concave portion is provided in a periphery part of the formation region, and a sealing cap in which a ring-shaped protruded bonding portion is provided in a part corresponding to the concave portion of the electronic parts forming substrate and a cavity is formed in a part corresponding to the formation region; and fitting the protruded bonding portion of the sealing cap into the concave portion of the electronic parts forming substrate. Thus, the MEMS element is hermetically sealed in the cavity of the sealing cap.