Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
July 13, 2010
Patent Application Number
11608429
Date Filed
December 8, 2006
Patent Citations Received
Patent Primary Examiner
Patent abstract
A metal thermal interface structure for dissipating heat from electronic components comprised a heat spreader lid, metal alloy that is liquid over the operating temperature range of the electronic component, and design features to promote long-term reliability and high thermal performance.
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