Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
July 20, 2010
Patent Application Number
11906853
Date Filed
October 4, 2007
Patent Primary Examiner
Patent abstract
A recessed portion is formed in an area, of a rear surface of a wafer, corresponding to a device formation area is formed by a rough grinding wheel of a rough grinding unit and an annular protruding portion is concurrently formed around the recessed portion. The inner circumferential lateral surface of the recessed portion is next ground by a finishing grinding wheel of a finishing grinding unit and the bottom surface is subsequently ground.
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