Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
July 20, 2010
Patent Application Number
11650459
Date Filed
January 8, 2007
Patent Primary Examiner
Patent abstract
Aiming at adjusting the height of bump electrodes connected to lands on a substrate, a semiconductor device 100 has a first interconnect substrate 103 and a second interconnect substrate 101. On one surface of these substrates, first lands 111 and second lands 113 are provided. The plane geometry of the second lands 113 is a polygon characterized by the inscribed circle thereof having an area smaller than the area of the inscribed circle of the first land.
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