US Patent 7760507 Thermally and electrically conductive interconnect structures
Patent 7760507 was granted and assigned to The Bergquist Company on July, 2010 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
December 26, 2007
Date of Patent
July 20, 2010
Patent Application Number
11964197
Patent Inventor Names
Radesh Jewram
0
Sanjay Misra
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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