Patent attributes
A patch panel assembly is provided including an angle module having one or more RJ modules, one or more insulation displacement contact (IDC) modules and a printed circuit board. Each of the RJ modules includes a base, an RJ plug receiving opening and spring contacts extending from the base into the RJ plug receiving opening. The IDC modules each include an IDC housing with an IDC module base and insulation displacement contacts (IDCs) with IDC contact pins extending from the IDC module base. The printed circuit board has RJ contact holes receiving the spring contacts with the RJ module mounted to the printed circuit board and has IDC contact holes receiving the IDC contact pins with the IDC module mounted to the printed circuit board as well as circuit traces connecting the RJ contact holes to the IDC contact holes. The plug receiving openings each have a plug insertion opening at an angle to the printed circuit board between to 0° and not equal to 90°. A front panel is provided including a front face with a plurality of RJ module openings. The angle module is connected to the frame with the one or more RJ modules extending through RJ module openings and with each the plug insertion opening at an angle to the front face between 0° and 90°.
