US Patent 7763526 Wafer and wafer cutting and dividing method

Patent 7763526 was granted and assigned to Denso on July, 2010 by the United States Patent and Trademark Office.

Overview Structured Data Issues Contributors Activity

Is a

Patent

Patent attributes

Current Assignee

Denso

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

7763526

Date of Patent

July 27, 2010

Patent Application Number

11598651

Date Filed

November 14, 2006

Patent Primary Examiner

‌

Charles D. Garber

Patent abstract

A laser beam is applied to an interior of a wafer through a top surface to form modified areas in a plurality of layers of modified area groups. Intervals of the modified areas in one of the layers of modified area groups differ from intervals of the modified areas in another one of the layers of the modified area groups, which is closer to the top surface of the wafer in comparison to the one of the layers of the modified area groups.

Timeline

No Timeline data yet.

Further Resources

Title

Author

Link

Type

Date

No Further Resources data yet.

References

Find more entities like US Patent 7763526 Wafer and wafer cutting and dividing method

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.

Open Query Tool

Access by API