Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Takaharu Yamano0
Date of Patent
July 27, 2010
0Patent Application Number
119845960
Date Filed
November 20, 2007
0Patent Primary Examiner
Patent abstract
It is a semiconductor device that has a semiconductor chip on which an electrode pad is formed, an electric connection member formed on the electrode pad, an insulating layer formed on the semiconductor chip, and an electrically conductive pattern connected to the electric connection member. An opening portion corresponding to the electric connection member is formed in the conductive pattern. The conductive pattern is electrically connected to the electric connection member by an electrically conducting paste embedded in the opening portion.
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