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US Patent 7765687 Method for mechanical packaging of electronics

Patent 7765687 was granted and assigned to Synqor on August, 2010 by the United States Patent and Trademark Office.

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Patent abstract

Electronics mounted on a printed circuit board are housed within a high conductivity case with connecting pins extending therethrough. The case is filled with thermally conductive potting material to provide thermal conduction from the printed circuit board to the case. The case may be a conduit having open ends through which the printed circuit board is inserted or it may comprise a cover mounted to a base plate.

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Patent Citations Received
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US Patent 11791089 Coil component
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Patent Inventor Names
Abram P. Dancy0
Leif E. LaWhite0
Lennart Pitzele0
Martin F. Schlecht0
Rene Hemond0
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US Patent 07765687 Method for mechanical packaging of electronics US Patent 7765687 Method for mechanical packaging of electronics

Infobox
Patent Number
077656870
Patent Number
77656870
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=077656870
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Infobox
Is a
Patent
Patent
0
Current Assignee
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Synqor
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
077656870
Date of Patent
August 3, 2010
0
Patent Application Number
115038740
Date Filed
August 11, 2006
0
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=077656870
Patent Primary Examiner
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A. Dexter Tugbang
0
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Website URL
https://pdfpiw.uspto.gov/.piw?Docid=07765687
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 US Patent 07765687 Method for mechanical packaging of electronics

Infobox
Is a
Patent
Patent
Current assignee
‌
Synqor
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
07765687
Date of patent
August 3, 2010
Patent application number
11503874
Date Filed
August 11, 2006
Patent primary examiner
‌
A. Dexter Tugbang

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