Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
August 3, 2010
Patent Application Number
11747310
Date Filed
May 11, 2007
Patent Primary Examiner
Patent abstract
A method for dicing a wafer is disclosed. One illustrative method includes forming a layer of frozen material above a plurality of integrated circuit dies on a substrate and performing a cutting process to cut through the layer of frozen material and the substrate to singulate the plurality of dies. Another method includes performing a cutting process to singulate a plurality of integrated circuit dies having a layer of frozen material formed above the plurality of dies.
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