Log in
Enquire now
‌

US Patent 7767562 Method of implanting using a shadow effect

Patent 7767562 was granted and assigned to Qimonda on August, 2010 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributors

Contents

Is a
Patent
Patent
0

Patent attributes

Current Assignee
Qimonda
Qimonda
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
77675620
Patent Inventor Names
Helmut Horst Tews0
Jochen Beintner0
Date of Patent
August 3, 2010
0
Patent Application Number
112353300
Date Filed
September 26, 2005
0
Patent Primary Examiner
‌
Jack Chen
0
Patent abstract

A semiconductor body has a first portion, a second portion, and an active area located between the first portion and the second portion. The first portion and the second portion are a shallow trench isolation region having an exposed surface extending above the surface of the active area. A first ion implantation is performed at a first angle such that a first shaded area defined by the exposed surface of the first portion and the first angle is exposed to fewer ions than a first unshaded area. A second ion implantation is performed at a second angle such that a second shaded area defined by the exposed surface of the second portion and the second angle is exposed to fewer ions than a second unshaded area.

Timeline

No Timeline data yet.

Further Resources

Title
Author
Link
Type
Date
No Further Resources data yet.

References

Find more entities like US Patent 7767562 Method of implanting using a shadow effect

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo

Company

  • Home
  • Press & Media
  • Blog
  • Careers
  • WE'RE HIRING

Products

  • Knowledge Graph
  • Query Tool
  • Data Requests
  • Knowledge Storage
  • API
  • Pricing
  • Enterprise
  • ChatGPT Plugin

Legal

  • Terms of Service
  • Enterprise Terms of Service
  • Privacy Policy

Help

  • Help center
  • API Documentation
  • Contact Us