Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Jinru Bian0
Date of Patent
August 3, 2010
0Patent Application Number
114372990
Date Filed
May 19, 2006
0Patent Primary Examiner
Patent abstract
The polishing fluid is useful for polishing tantalum-containing barrier materials of a semiconductor substrate. The polishing fluid includes a nitrogen-containing compound having at least two nitrogen atoms comprising imine compounds and hydrazine compounds. The nitrogen-containing compound is free of electron-withdrawing substituents; and the polishing fluid is capable of removing the tantalum-containing barrier materials from a surface of the semiconductor substrate without an abrasive.
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