Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
August 3, 2010
Patent Application Number
11860855
Date Filed
September 25, 2007
Patent Primary Examiner
Patent abstract
A semiconductor device has a semiconductor chip bonded to external connection pads or external connection terminals by flip-chip bonding and an underfill resin, and provides a semiconductor device which enables to lessen the warpage attributable to the underfill without involvement of an increase in the size of the semiconductor device. A low elastic resin member is disposed opposite to a surface of a semiconductor chip on which a plurality of electrode pads are formed, and an underfill resin is filled between the semiconductor chip and the low elastic resin member and between electrode pads and external connection pads.
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