Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
August 3, 2010
Patent Application Number
12436655
Date Filed
May 6, 2009
Patent Primary Examiner
Patent abstract
An improvement for an assembly for use in a computing device which includes a microprocessor and a motherboard and a socket for receiving and making electric contact with the microprocessor. A heat sink is included which is in thermal contact with the microprocessor whereby a water barrier is applied to and proximate the socket for preventing water of condensation from contacting areas covered by the water barrier and a moisture absorbent surrounding the heat sink.
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