Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
August 10, 2010
Patent Application Number
12235442
Date Filed
September 22, 2008
Patent Primary Examiner
Patent abstract
It is an object of the present invention to provide a composition capable of forming an insulating film which is endowed with a low dielectric constant, heat resistance, chemical resistance and a high mechanical strength that enables the insulating film to withstand CMP, and which, when an inorganic insulating film layer is provided thereon as an overlying layer, has a high adherence thereto. The composition for forming an insulating film contains polyphenylene, wherein the polyphenylene in an insulating film formed from the composition has a number of carbon atoms (C) and a number of oxygen atoms (O) which together satisfy a condition O/(C+O)≧0.050. With the composition, the above object is attained.
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