Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yoshiharu Itahana0
Akio Sawabe0
Junji Nakamura0
Date of Patent
August 17, 2010
0Patent Application Number
113658870
Date Filed
March 2, 2006
0Patent Primary Examiner
Patent abstract
A ceramic circuit substrate and a manufacturing method thereof are provided, which has excellent thermal shock tolerance by forming a gap between a circuit pattern section and a ceramic substrate, and has a capability of preventing etchant residue from remaining therein. The ceramic circuit substrate according to the present invention includes patterns of brazing material (8 and 9) formed on the ceramic substrate, and a circuit pattern section jointed to the patterns of brazing material. The patterns of brazing material includes a line pattern along the edge of the circuit pattern. Also, a gap is formed within the line pattern located between the ceramic substrate and the circuit pattern.
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