Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Toshihiro Itoh0
Tadatomo Suga0
Date of Patent
August 17, 2010
0Patent Application Number
118891000
Date Filed
August 9, 2007
0Patent Primary Examiner
Patent abstract
The present invention relates to a semiconductor device in which electrodes formed on a semiconductor chip and electrodes formed on a wiring board are electrically connected via projecting elastic electrodes, and further relates to a mounting method of reducing a pressure applied to electrodes formed on a substrate or underlying wirings when a semiconductor chip and a wiring board are bonded.
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