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US Patent 7777351 Thin stacked interposer package

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
October 1, 2007
Date of Patent
August 17, 2010
Patent Application Number
11865617
Patent Citations Received
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US Patent 12107042 Localized high density substrate routing
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US Patent 11990382 Fine pitch BVA using reconstituted wafer with area array accessible for testing
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US Patent 12009322 Package structure with through-via in molding compound and dielectric layer
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US Patent 12009343 Stackable package and method
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US Patent 11700692 Stackable via package and method
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US Patent 11855023 Wafer level fan out semiconductor device and manufacturing method thereof
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US Patent 11869875 Electronic device having a substrate-to-substrate interconnection structure and manufacturing method thereof
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US Patent 11942581 Semiconductor device with transmissive layer and manufacturing method thereof
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US Patent 11961805 Devices and methods related to dual-sided radio-frequency package with overmold structure
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US Patent 11984396 Localized high density substrate routing
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
7777351
Patent Primary Examiner
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Davienne Monbleau

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