Patent attributes
Method and apparatus for precisely removing dusts from a side edge of a wafer, improving a production yield of wafers, and reducing a manufacturing cost for semiconductor devices. The apparatus includes: a retaining table having a circular top plan view, capable of retaining the wafer disposed on the top surface, and being rotated in the wafer cleaning; a feeding unit for supplying a cleaning solution to a top surface of the wafer; a cup member for recovering the cleaning solution supplied to the wafer, the cup member surrounding a radially outer circumference and a bottom of the retaining table; and a guard member disposed inside the cup member so as to be spaced apart from the retaining table, which surrounds the radially outer circumference of the retaining table.
