Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
August 24, 2010
Patent Application Number
11753957
Date Filed
May 25, 2007
Patent Citations Received
Patent Primary Examiner
Patent abstract
A method of forming a wire bond with a bonding tool is provided that comprises the steps of forming a ball bond onto a bonding surface, raising the bonding tool away from the ball bond to form a neck portion integrated with a top of the ball bond, locating a circumference of a tip of the bonding tool onto the neck portion, pressing the neck portion with the circumference of the tip to form a depression in the neck portion without bonding the neck portion to the ball bond, and thereafter raising the bonding tool away from the ball bond.
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