Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
August 24, 2010
Patent Application Number
12320028
Date Filed
January 15, 2009
Patent Citations Received
Patent Primary Examiner
Patent abstract
A method of manufacturing a semiconductor device includes the steps of bonding a semiconductor chip to a first side of a circuit board, bonding a metal base for dissipating heat produced by the semiconductor chip to a second side of the circuit board, and forming a dam on the metal base by a dam material so as to restrict flow of a solder used in bonding a plurality of the circuit boards to the metal base.
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