US Patent 7781670 Organic photovoltaic component with encapsulation

The invention concerns an organic photovoltaic component with a novel encapsulation, wherein the invention for the first time discloses packaging for organic solar cells that includes a low-cost film composite comprising a metal portion. The packaging meets high requirements, particularly with respect tohigh barrier properties against oxygen and water vaporencapsulation without or with only minimal adhesive joints, since the encapsulation can be welded/soldered to the substrate or the bottom electrode,integrated lead-through of electrical connections, including adhesive-bonded, soldered and/or welded connections.