Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Ming-Yuan Huang0
Chih-Chun Yang0
Chih-Hung Shih0
Date of Patent
August 24, 2010
0Patent Application Number
116253590
Date Filed
January 22, 2007
0Patent Primary Examiner
Patent abstract
The invention provides a method for manufacturing an array substrate utilizing a laser ablation process. A conductive layer can be selectively patterned by the laser ablation process without a photo mask due to different adhesions between the conductive layer and other materials. The patterned conductive layer thus formed adjoins an inorganic passivation layer to provide a substantially continuous surface.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
