Patent attributes
An electronic device with a cooling system includes an enclosure. A first electronic component and a second electronic component in parallel are received in the enclosure. Air inlets are defined in a front board of the enclosure to receive cool air. A first flow of the cool air passes through a main airflow path to cool the first electronic component and the second electronic component. A second flow of the cool air passes through an auxiliary airflow path to cool the second electronic component. The main airflow path and the auxiliary airflow path are separated by a clapboard. The cool air heated by the first and second electronic components is then exhausted through the air outlets defined in a back board of the enclosure.