US Patent 7783142 Low stress package

Consistent with the present disclosure, a package is provided in which the PLC substrate, for example, is bonded to the underyling carrier though a limited contact area. The rest of the substrate is detached from the carrier so that stresses are applied to a limited portion of the PLC substrate. The PLC itself, however, is provided over that portion of the substrate that is detached from the carrier, and thus experiences reduced stress. Accordingly, high modulus adhesives, as well as solders, may be used to bond the PLC substrate to the carrier, thereby resulting in a more robust mechanical structure.