A kit apparatus has a package holding at least one film sheet having an adhesive layer on one side, a bottle containing a solution for activating the adhesive layer of the film sheet, and a miniature squeegee. The film sheet, bottle of solution and squeegee are secured within the package. The sheet corresponds in extent to a surface of an electronic device, preferably a surface of a display device of the electronic device. The solution is used for initially cleaning the surface that is to receive the sheet and finally to wet the adhesive layer in order to secure the sheet in place. Excess solution is removed from the surface while evenly distributing the adhesive using wiping motions with the squeegee.