A printhead assembly includes a chassis, an ink reservoir secured on the chassis and printhead modules attached to the reservoir. Each printhead module includes a first molding defining a plurality of ink chambers and a plurality of clips. The clips are releasably engaged with receiving formations defined by the ink reservoir. A second molding is in engagement with the fist molding to cover the ink chambers. A sub-assembly is attached to the second molding. The sub-assembly includes an ink ejection integrated circuit which is supplied with ink from the ink chambers via the second molding and a Tape Automated Bond (TAB) film which is electrically connected to the integrated circuit.