US Patent 7791183 Universal low cost MEM package

A universal micro-electro mechanical (MEM) device package is provided as having a relatively thin silicon-on-insulator (SOI) wafer having a top surface and a bottom surface. At least on MEM device maybe disposed on the top surface of the SOI wafer. A support member may be disposed on predetermined portions of the top surface of the SOI wafer to substantially surround the MEM device. A cap layer may be positioned over and in contact relationship with the support member. In this arrangement, the support member cooperates with the cap layer and predetermined portions of the top surface of the SOI wafer to form a hermetically sealed chamber surrounding the MEM device.