US Patent 7795093 Front-end processing of nickel plated bond pads
Patent 7795093 was granted and assigned to Micron Technology on September, 2010 by the United States Patent and Trademark Office.
All edits
Edits on 31 Oct, 2023
Golden AI
Edits made to:
Article (+284 characters)
Article
Patent abstract
A front-end method of fabricating nickel plated caps over copper bond pads used in a memory device. The method provides protection of the bond pads from an oxidizing atmosphere without exposing sensitive structures in the memory device to the copper during fabrication.
Edits on 18 Sep, 2023
Golden AI
Edits made to:
Infobox (+2 properties)
Infobox
Patent Inventor Names
John Moore0
Joseph F. Brooks0
Edits on 15 Jul, 2023
Golden AI
Edits made to:
Infobox (+1/-1 properties)
US Patent 07795093 Front-end processing of nickel plated bond pads US Patent 7795093 Front-end processing of nickel plated bond pads
Infobox
Patent Number
077950930
Patent Number
77950930
Edits on 20 May, 2023
Golden AI
Edits made to:
Infobox (-1 properties)
Infobox
Official Website
Edits on 24 Sep, 2022
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
077950930
Date of Patent
September 14, 2010
0Patent Application Number
122198360
Date Filed
July 29, 2008
0Official Website
Patent Primary Examiner
Edits on 3 Jun, 2022
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Website URL
Edits on 5 Dec, 2021
Golden AI
Edits made to:
Infobox (+8 properties)
US Patent 07795093 Front-end processing of nickel plated bond pads
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07795093
Date of patent
September 14, 2010
Patent application number
12219836
Date Filed
July 29, 2008
Patent primary examiner
Find more entities like US Patent 7795093 Front-end processing of nickel plated bond pads
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
