Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
September 14, 2010
Patent Application Number
12033917
Date Filed
February 20, 2008
Patent Primary Examiner
Patent abstract
The semiconductor device includes a silicon interposer made of a semiconductor and a first semiconductor chip mounted on one surface of the silicon interposer. The semiconductor device is provided with a through electrode penetrating the silicon interposer and having a side surface insulated from the silicon interposer; and a wiring connecting one end of the through electrode and the silicon interposer. The through electrode is connected to a power supply wiring or a GND wiring provided on the first semiconductor chip.
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