Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Toshinori Shima0
Kazuki Ikeda0
Syunsuke Ishikawa0
Takaaki Anada0
Hisao Irie0
Date of Patent
September 21, 2010
0Patent Application Number
117270140
Date Filed
March 23, 2007
0Patent Primary Examiner
Patent abstract
A flux for soldering used when soldering is performed to a board subjected to electroless nickel plating, the flux containing resin having film forming ability, activator, and solvent, and further containing metallic salt in an amount of 0.1 to 20% by weight of the total amount of flux. The use of this flux suppresses diffusion of nickel solder in soldering portions, and prevents concentration of phosphorous, thereby improving the bonding strength of soldering.
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