Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hiroshi Shinriki0
Hiroaki Inoue0
Date of Patent
September 21, 2010
Patent Application Number
12129345
Date Filed
May 29, 2008
Patent Primary Examiner
Patent abstract
A method for forming interconnect wiring, includes: (i) covering a surface of a connection hole penetrating through interconnect dielectric layers formed on a substrate for interconnect wiring, with an underlying alloy layer selected from the group consisting of an alloy film containing ruthenium (Ru) and at least one other metal atom (M), a nitride film thereof, a carbide film thereof, and an nitride-carbide film thereof, and (ii) filling copper or a copper compound in the connection hole covered with the underlying layer.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
