US Patent 7799865 Rapidly curing formulations including a conductive component

A curable composition for forming anisotropically conductive bonds comprising: (i) an amount of first substantially uncured curable component; (ii) conductive particles coated with a substantially uniformly thick coating of the cure product of a second curable component dispersed within the first curable cyanoacrylate component. The composition is suitable for use as an adhesive composition for bonding chips to electronic circuits. Desirably the first component and the second component are both cyanoacrylates.