US Patent 7800002 Multilayer wiring board
Patent 7800002 was granted and assigned to Dai Nippon Printing on September, 2010 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
November 14, 2005
0
Date of Patent
September 21, 2010
0
Patent Application Number
11791572
0
Patent Inventor Names
Shigeki Chujo
0
Koichi Nakayama
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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