Patent 7800021 was granted and assigned to Husky Injection Molding Systems on September, 2010 by the United States Patent and Trademark Office.
A heater that may be applied to a substrate. The heater may include a graduating material deposited on at least a portion of a substrate, a resistive material and a thermal barrier dielectric coating. The resistive material may include at least two resistive compositions, wherein the resistivity of the material may be altered by varying the composition in given areas.