US Patent 7803281 Selective bonding for forming a microvalve
Patent 7803281 was granted and assigned to Microstaq on September, 2010 by the United States Patent and Trademark Office.
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Patent abstract
A method for forming a micromachined device is disclosed that includes providing a first silicon layer and a second silicon layer. A coating is provided on a first portion of the first layer. The first layer and the second layer are bonded to each other to form a micromachined device, the coating being effective to prevent the coated first portion of the first layer from bonding to the second layer.
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US Patent 07803281 Selective bonding for forming a microvalve US Patent 7803281 Selective bonding for forming a microvalve
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Patent Number
0780328100
Patent Number
780328100
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Is a
Current Assignee
Patent Jurisdiction
Patent Number
078032810
Date of Patent
September 28, 2010
0Patent Application Number
105909540
Date Filed
February 15, 2005
0Official Website
Patent Primary Examiner
Edits on 23 Sep, 2022
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
078032810
Date of Patent
September 28, 2010
0Patent Application Number
105909540
Date Filed
February 15, 2005
0Official Website
Patent Primary Examiner
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US Patent 07803281 Selective bonding for forming a microvalve
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07803281
Date of patent
September 28, 2010
Patent application number
10590954
Date Filed
February 15, 2005
Patent primary examiner
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