Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
September 28, 2010
Patent Application Number
11854066
Date Filed
September 12, 2007
Patent Primary Examiner
Patent abstract
A mold structure for packaging LED chips includes a top mold and a bottom mold. The bottom mold is mated with the top mold. The bottom mold has a main flow channel, a plurality of receiving spaces formed beside the main flow channel, a plurality of secondary flow channels for respectively and transversely communicating the receiving spaces with each other, and a plurality of ejection pins penetrating through the bottom mold.
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