Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Sheila F. Chopin0
Yuan Yuan0
Date of Patent
September 28, 2010
0Patent Application Number
118601250
Date Filed
September 24, 2007
0Patent Primary Examiner
Patent abstract
A method for curing an encapsulant that surrounds a plurality of integrated circuits on a strip that forms a strip assembly is provided. The strip assembly is composed of units for packaging and the units each have edges defining a perimeter of the unit. The strip assembly is placed on a shelf. Pressure from deformable material or springs is applied to the strip assembly in regions of the strip. The regions are located at one of a group of locations consisting of along unit edges and centered between unit edges. Heat of sufficient temperature is applied for a sufficient duration to cure the encapsulant. The step of applying pressure continues during the application of heat for curing.
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