Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chuan Cheah0
Kunzhong Hu0
Date of Patent
September 28, 2010
0Patent Application Number
117967710
Date Filed
April 30, 2007
0Patent Primary Examiner
Patent abstract
A multi-chip module that includes a conductive element connecting at least two semiconductor devices, the conductive element including enhancements for improving the mechanical coupling between the conductive element and the molded housing of the MCM.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
