Patent attributes
A pusher 200 that pushes a semiconductor device under test 300 against a test socket 500 in a semiconductor test apparatus 20 is provided that includes a main body section 210 that is thermally coupled with the thermal source 400 and a plurality of device pushing sections 220, each of which is physically and thermally coupled to the thermal source 400, is displaced toward the test socket 500 by the pushing force of the main body section 210 to contact a surface to be pushed of a semiconductor device under test 300, pushes the semiconductor device under test 300, and transmits heat from the thermal source 400 to the semiconductor device under test 300. Thermal conductivity between the pusher and the semiconductor device under test is enhanced to provide a pusher that can quickly and accurately test a semiconductor device.
