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US Patent 7806684 Method of semiconductor process and semiconductor apparatus system

Patent 7806684 was granted and assigned to United Microelectronics Corporation on October, 2010 by the United States Patent and Trademark Office.

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Patent

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Current Assignee
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
7806684
Patent Inventor Names
Guang-You Yu0
Date of Patent
October 5, 2010
Patent Application Number
11866117
Date Filed
October 2, 2007
Patent Primary Examiner
‌
Gregory A. Wilson
Patent abstract

A method of a semiconductor process is provided. The semiconductor process at least includes a first high temperature furnace process and a second high temperature furnace process. In the method, the first high temperature furnace process is performed on a first wafer boat carrying at least a wafer. Then, the second high temperature furnace process is performed on a second wafer boat carrying at least the same wafer. In addition, before the second high temperature furnace process is implemented, a moving step is performed, such that a relative position of the wafer in the first wafer boat is different from that of the wafer in the second wafer boat.

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