Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Shi-Ping Luo0
Date of Patent
October 5, 2010
0Patent Application Number
116857790
Date Filed
March 14, 2007
0Patent Primary Examiner
Patent abstract
A support device for heat dissipation module provides a frame with four corners thereof extending outward a support part respectively. A mounting opening is disposed at the central area of the frame with two opposite side of the mounting opening having a projection plate respectively. A facial side of the projection plate is provided with fitting pins to fit with a guide heat plate and covering the mounting opening without help of welding. Therefore, thinner guide heat plate can be used for simplifying manufacturing process and lowering production cost.
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