Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
October 5, 2010
Patent Application Number
11982630
Date Filed
November 2, 2007
Patent Primary Examiner
Patent abstract
The present invention relates generally to heat removal from circuit board components and, more specifically, to improved thermal management for circuit board components mounted on electrical wiring boards. The structure comprises a heat sink; and an auxiliary heat sink positioned in thermal contact with the heat sink and a circuit board component on a wiring board, the auxiliary heat sink having a plurality of slots located in a central portion of the auxiliary heat sink, wherein the auxiliary heat sink is both mechanically compliant and thermally conductive with both the heat sink and the circuit board component.
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