US Patent 7810703 Wire bonding method
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Patent abstract
A wire bonding apparatus includes a heat block and a heat plate provided on the heat block. A recess is provided in the heat plate to receive the first semiconductor chip and wires without contact therewith when the lead frame is provided on the heat plate such that the first main surface of the lead frame faces toward heat plate. A duct is provided in the heat plate to connect the recess to the outside of the heat plate. A gas supplied through the duct is heated by a heater and discharged into the recess.
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US Patent 07810703 Wire bonding method US Patent 7810703 Wire bonding method
Infobox
Patent Number
0781070300
Patent Number
781070300
Edits on 25 Apr, 2023
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
078107030
Date of Patent
October 12, 2010
0Patent Application Number
122921740
Date Filed
November 13, 2008
0Official Website
Patent Primary Examiner
Edits on 23 Sep, 2022
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
078107030
Date of Patent
October 12, 2010
0Patent Application Number
122921740
Date Filed
November 13, 2008
0Official Website
Patent Primary Examiner
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US Patent 07810703 Wire bonding method
Infobox
Is a
Patent jurisdiction
Patent number
07810703
Date of patent
October 12, 2010
Patent application number
12292174
Date Filed
November 13, 2008
Patent primary examiner
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